Toshiba 811T Announced

Toshiba 811T has been announced for Vodafone in Japan. This 3G phone supports triband GSM and W-CDMA. The 811T features monochrome OLED external display, 3.2MP camera with LED flash, 2.4-inch TFT-LCD display (240×320) and 0.3MP camera for music player, GPS, microSD card slot and video calls. The 811T is available in black and pink. The pink Toshiba 811T is available now in Japan.

+ PRESS RELEASE:

Toshiba Expands Dynastron(R) CMOS Image Sensor Line-Up With 3.2 Megapixel and 2.0 Megapixel Chips; 2.0 Megapixel SoC Incorporates ISP for Advanced Camera Operations and Special Picture Effects

Company Reinforces CMOS Imaging Leadership With New Devices Combining Small
Pixel Size and Superb Picture Quality; Targeted at Expected 2007 Market
Sweet Spot for Camera Phones

SAN JOSE, Calif., Sept. 27 /PRNewswire/ — Toshiba America Electronic
Components, Inc. (TAEC)* today announced the further expansion of its
industry-leading Dynastron(R) complementary metal oxide semiconductor
(CMOS) image-sensor product line with the addition of two new chips, the
3.2 megapixel ET8EE6-AS CMOS image sensor and 2.0 megapixel ET8EF2-AS CMOS
image sensor SoC with integrated image-signal processor (ISP). With a pixel
pitch of just 2.2 microns, a significant advance in cell-size
miniaturization compared to the 2.7-micron pixel pitch of previous 2- and
3.2-megapixel products, they enable development of smaller, space-saving
camera modules for cellular phones and other camera-enabled mobile devices.
Toshiba Corporation (Toshiba) will be exhibiting the ET8EE6-AS and
ET8EF2-AS chips at CEATEC JAPAN 2006 being held from October 3 to October 7
at Makuhari Messe.

“With the launch of our new 3.2 megapixel and 2.0 megapixel Dynastron
chips, we can meet cell-phone manufacturers’ camera-phone requirements for
a smaller optical-format image sensor with best-in-class picture quality,”
said Andrew Burt, vice president of the Imaging and Communications
Marketing Group in the ASSP Business Unit at TAEC. “We are geared up to
meet anticipated strong demand in the 1/4-inch 2.0 megapixel market space
in 2007 and our customers are showing a high level of interest in our 3.2
megapixel device for high-end camera phones as well. Our customers count on
Toshiba’s huge mass-production capability and continue to design-in our
full range of products, including VGA, 1.3 megapixel, 2 megapixel and 3.2
megapixel products. The new devices are also examples of Toshiba’s
commitment to support its customers with both on-chip and off-chip ISPs to
suit various cell-phone system architectures.”

Toshiba engineers were able to reduce the pixel pitch in both image
sensors from 2.7 microns to 2.2 microns while retaining a pixel size
capable of recording high-resolution images. With the ET8EE6-AS, Toshiba
reduced a 3.2-megapixel image sensor to a 1/3.2 optical format, an
improvement over the company’s previous 1/2.6-inch format size. ET8EF2-AS
achieves a 2.0 megapixel count in a 1/4-inch optical format. The new
sensors also offer low-power consumption, smearless imaging and high-speed
operation, all essential requirements for personal mobile equipment,
including camera phones and personal media centers. (A smear is a vertical
stripe in an image and can occur in bright-light conditions, such as direct
sunlight.) ET8EF2-AS also integrates an ISP for sophisticated picture
effects and advanced camera operations, such as digital zoom, windowing,
image downsizing and picture flip.

Highlights:

* Advances in the Toshiba Dynastron technology, including an improved
photo-diode configuration and optimized pixel size, brought pixel pitch
down to 2.2 microns, with uncompromised image quality. These advances
led to a 3.2 megapixel count in a 1/3.2-inch format and 2.0 megapixel
count in a 1/4-inch format.
* In video mode, ET8EE6-AS offers high-speed 15-frames per second (fps)
in QXGA output, and 30fps in 3-to-1 vertical pixel binning. ET8EF2-AS
also supports 15fps in UXGA output, and 30fps in VGA output.
* To support simplified design of an optimized camera system, ET8EE6-AS
provides integrated automatic blemish detection and correction, gain
control and lens shading compensation.
* Features of the ET8EF2-AS include auto white balance, auto luminance
control, and automatic blemish correction.
* ET8EF2-AS also incorporates an ISP to provide advanced functions,
including:
- Digital zoom
- Windowing to any arbitrary size with panning
- Image down sizing with programmable decimation
- Picture flip that includes right/left flip and top/bottom flip
- Picture effects that include monochrome, negative, sepia, antique,
sketch and emboss
* Both products incorporate a flexible input clock supported by a
phase-locked loop circuit.

Technical Specification Summary

Part Number: ET8EE6-AS ET8EF2-AS
Optical format 1/3.2-inch 1/4-inch
Megapixel Approx. 3.2 Approx. 2.0
Pixel count 2,080 (H) x 1,560 (V) (max.) 1,664 (H) x 1,248 (V) (max.)
Cell size 2.2 microns (H) x 2.2microns (V)
Output signal RAW data: 12bit parallel/sub YUV422/ RGB686/ RGB565/
LVDS (serial) RGB444/RAW (parallel)
Clock
frequency 6MHz-20MHz
Frame rate 15fps at QXGA output; 15fps at UXGA output;
30fps at 3-to-1 vertical 30fps at VGA output
pixel binning
Interface
control I2C bus
Power supply 1.8V (digital) 1.8V (digital, I/O)
2.8V (analog, I/O) 2.8V (analog)
Operating
temperature: -20 degrees to 60 degrees C
Package Non-diced wafer

About Toshiba CMOS Image Sensor Technology
Toshiba is a pioneer and recognized leader in the development of CMOS
image sensors with core competencies in advanced sensor technology and
sophisticated signal processing technology. Toshiba Dynastron CMOS image
sensors employ a special square-pixel design that enables them to achieve
high-quality images with low-power consumption, even in low-light
conditions. Dynastron CMOS image sensors have proven their superiority in
image-quality comparisons by offering demonstrably better color balance and
picture quality.

Pricing and Availability
Samples of the ET8EE6-AS 3.2-megapixel device are currently available
and are priced at $43.00 in 1,000-piece quantities. The devices are in full
production at a production rate of 1 million units a month, or greater.
Samples of the ET8EF2-AS 2.0-megapixel SoC are available now and are priced
at $35.00 in 1,000-piece quantities. Production of the ET8EF2-AS is planned
to start at the end of 2006 at a production rate of 1 million units a
month, or greater.

*About TAEC
Combining quality and flexibility with design engineering expertise,
TAEC brings a breadth of advanced, next-generation technologies to its
customers. This broad offering includes memory and flash memory-based
storage solutions, a broad range of discrete devices, displays, medical
tubes, ASICs, custom SOCs, microprocessors, microcontrollers and wireless
components for the computing, wireless, networking, automotive and digital
consumer markets.

TAEC is an independent operating company owned by Toshiba America,
Inc., a subsidiary of Toshiba Corp. (Toshiba), Japan’s largest
semiconductor manufacturer and the world’s fourth largest semiconductor
manufacturer. In more than 130 years of operation, Toshiba has recorded
numerous firsts and made many valuable contributions to technology and
society. For additional company and product information, please visit
TAEC’s website at chips.toshiba.com. For technical inquiries, please e-mail
Tech.Questions@taec.toshiba.com.

Information in this press release, including product pricing and
specifications, content of services and contact information, is current and
believed to be accurate on the date of the announcement, but is subject to
change without prior notice. Technical and application information
contained here is subject to the most recent applicable Toshiba product
specifications. In developing designs, please ensure that Toshiba products
are used within specified operating ranges as set forth in the most recent
Toshiba product specifications and the information set forth in Toshiba’s
“Handling Guide for Semiconductor Devices,” or “Toshiba Semiconductor
Reliability Handbook.” This information is available at
http://www.chips.toshiba.com, or from your TAEC representative.

All trademarks and tradenames used herein are the properties of their
respective holders. Dynastron is a registered trademark of Toshiba
Corporation in the United States and certain other countries.

SOURCE Toshiba America Electronic Components, Inc.